THE PROBLEM... The solder joints that connect BGA and CSP devices to the contacts on the PCB are made when arrays of dozens, or even hundreds, of tiny spheres of solder attached to the bottom of the device are melted during the reflow soldering process. Because these connections are located underneath the components, visual inspection is nearly impossible.
When we subjected several motherboards (from Xbox 360 consoles that suffered the "Red Ring of Death" failure) to microscopic X-ray inspection, it was determined that a substantial number of the solder joints beneath the BGA and CSP devices appeared to be of questionable quality. This was especially noticeable towards the centers of the main CPU and GPU (Graphics Processing Unit).
THE SOLUTION...
Download this Free eBook #3... Developed By Manncorp, Willow Grove, PA July 10, 2007
Fix the Red Ring of Death! (without towels!) Dr.Professor Jake Biggs - Xbox Repair Guide #4 CLICK HERE
Fix the Red Ring of Death! (without towels!) Dr.Professor Jake Biggs - Xbox Repair Guide #4 CLICK HERE
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